Solar Cells with high welding ability, optimized template design, zero defect appearance
MBB solar cell with silicon nitride anti-reflective coating. Uniform navy blue
MBB solar cell with monocrystal pyramid pattem surface and polycrystalline silicon volute pattern surface High nucleation density, large receiving area, low reflectivity
MBB solar cell with parallel resistance test to reduce hot spot effect and test weak light response Precise and efficient selection of chips, sorted into 12 levels according to the power of a single chip, Accuracy up to + 0.1% Appearance sorting to ensure that all cells in the assembly are similar in color
G1 solar cell size is 158.75-158.75mm. The dicing process in module production is divided into full and half. There are 5BB and 9BB. The appearance of Sunrise selection is zero defects. G1 solar cell size mono cell with higher welding ability, considering cell efficiency, production yield, and market analysis, it is confirmed that 9BB is the best solution. Innovative PERC technology and 9BB design shorten the current transmission distance and reduce the resistance loss. So that the conversion efficiency of the MBB solar cell can be improved, and the impact on the performance of the module is reduced.
|Front (−)||9 *0.1mm busbars(Silver), 114 finger grids, Blue anti-reflecting coating (silicon nitride)|
|Back (+)||Width of the back electrode (Silver) 1.8mm, 9 busbars (aluminum), 150 finger grids (aluminum), Blue anti-reflecting coating (silicon nitride) |
9BB P-type bifacial half-cut cell can contribute up to 30% of the gain in the module power generation process. The half-cut cell technology has higher conversion efficiency than the full cell and has a lower rated operating temperature. Compared to the full cell module, the half cell module temperature is 2-3 degrees lower, and the hot spot temperature is 10-20 degrees lower. At the same time, MBB solar cell has a lower shadow mask loss.
It has better IAM performance than conventional flat ribbons when light is incident. The 9BB with a smaller ribbon design can reduce the impact of stress. Make the module resistant to high and low-temperature performance and mechanical load performance.
|Front Side (−)||9 *0.1mm busbars(Silver), 114 finger grids, Blue anti-reflecting coating (silicon nitride)|
|Rear Side (+)||Width of back electrode(silver) 1.3±0.25mm, finger grids(aluminum), dotted laser|