M10 solar cell, compared with the existing product span, equipment, process, auxiliary material maturity, production line upgrading difficulty, current product yield, and other factors, the M10 cell busbar P-type bifacial half-cut is the best size to achieve ultra-high power modules, more mature industrial ecology, fewer transportation problems.
The M10 cell P-type bificial half cut solar cell could provide up to 30% of the gain in the generation process of the modules, as for the half cut cell technology has a higher conversion efficiency than the full piece.
Compared with the full cell modules, the temperature of the mono perc cell module is 2-3 degrees lower, and the hot spot temperature is 10-20 degrees lower.
M10 cell has a lower shadow shielding loss.
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| Dimension: | 182mm×182mm±1.5mm，Diagonal 247mm±0.5mm |
| Thickness (Cell): | 180±18μm |
| Front (−): | 10*0.06mm+-0.03mm main busbar（silver）136+-10mm asitbusbar， Blue anti-reflecting coating (silicon nitride) |
| Back (+): | width of back electrode(silver) 1.4±0.3mm, finger grids(aluminum), dotted laser design |
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The P-type bifacial half-cut mono perc solar cell could provide up to 30% of the gain in the generation process of the modules, as the mono perc half cell technology has a higher conversion efficiency than the full piece, and also a lower-rated operating temperature. Compared with the full cell modules, the temperature of the mono half cell module is 2-3 degrees lower, the hot spot temperature is 10-20 degrees lower, and it has a lower shadow shielding loss.
Compared with the existing product span, equipment, process, auxiliary material maturity, production line upgrading difficulty, current product yield, and other factors, the M10 cell busbar P-type bifacial half-cut is the best size to achieve ultra-high power modules, more mature industrial ecology, fewer transportation problems.
| Dimension | 182mm×182mm±1.5mm |
| Thickness (Cell) | 180±18μm |
| Front (−) | 1.0mm/1.5mm wide soldering pads(silver) and 0.1mm bus bars(silver), SiOx/SiNx stack layers (PID Free) |
| Back (+) | 1.3mm wide soldering pads(silver), AlOx/SiNx stack layers (PERC structure) |
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